Prexonics® for Semiconductor Manufacturing
Digital Metal Coatings Redefining Efficiency and Flexibility
Prexonics® is the World's Leading Turnkey Solution for Digital Printing of Electronic Metal Coatings
Heraeus Printed Electronics redefines precision metallization in the semiconductor industry. With Prexonics®—our turnkey solution consist of particle-free metal inks, inkjet machines, and deep process know-how—you can implement selective, maskless metal coatings tailored to modern semiconductor manufacturing.
Precision and Efficiency in Electronic Coatings
- Our system features the specially formulated Prexonics® particle-free silver ink and the Prexonics® inkjet printing system, both engineered for effective 2.5D selective coating. This innovative approach allows for inkjet printing of precise pattern layouts, meeting the needs of miniaturization in electronics packaging.
Customized Thin Metallization Film
- Our digital printing technology enables the manufacturing of metallization films ranging from 150 nm to 5 μm, with conductivity levels at 20-50% of bulk silver.
- Central to our system is the Prexonics® Image Processor that accurately transforms CAD designs into precisely coated semiconductor components.
- The entire process, encompassing pre-treatment, inkjet printing, and sintering into a metallic silver film, is automated and fulfills the highest semiconductor industry standards.
Our turnkey solution enables a wide range of applications
| Package-Level EMI Shielding | Maskless selective silver coating for conformal and compartment shielding on EMC and other substrates |
| EMI Shielding on Exposed-Die Package | Silver coating on both EMC and Si surfaces for superior heat dissipation |
| Thermal Interface Material (TIM) | Silver coating for superior heat dissipation to the heat spreader |
| Die Back-Side Metallization (BSM) | Silver Coating with enhanced electrical and thermal connection to the assembly |
| Substrate Metalization (alternative to plating) | Maskless selective coating of highly conductive structures on diverse substrates or connectors |
| Antenna Printing | Printing of antenna structures on substrates with various shapes (EMC, ceramic, etc.) |
| Fine-Line Printing | Printing of conductive traces on various substrates (EMC, glass, ceramic, PI, etc.) |
